HB52D328DC-B Datasheet, PDF (16/24 Pages) Elpida Memory – 256 MB Unbuffered SDRAM S.O.DIMM 32-Mword × 64-bit, 100 MHz Memory Bus, 2-Bank Module (8 pcs of 16 M × 16 components) PC100 SDRAM

HB52D328DC-B
DC Characteristics (Ta = 0 to 65°C, V_CC = 3.3 V ± 0.3 V, V_SS = 0 V)
HB52D328DC
-A6B/B6B/A6BL/B6BL
Parameter
Symbol Min
Max
Unit Test conditions
Notes
Operating current
(CE latency = 2)
I _CC1
—
(CE latency = 3)
I _CC1
—
Standby current in power down I_CC2P
—
Standby current in power down I_CC2PS —
(input signal stable)
Standby current in non power I_CC2N
—
down
Active standby current in power I_CC3P
—
down
Burst length = 1
520
mA t_RC = min
1, 2, 3
520
mA
24
mA CKE = V_IL, t_CK = 12 ns 6
16
mA CKE = V_IL, CK0/CK1 = 7
V_IL or V_IH Fixed
160
mA CKE, S = V_IH,
4
t_CK = 12 ns
32
mA CKE = V_IH, t_CK = 12 ns 1, 2, 6
Active standby current in non I_CC3N
—
power down
Burst operating current
(CE latency = 2)
(CE latency = 3)
Refresh current
Self refresh current
I _CC4
—
I _CC4
—
I _CC5
—
I _CC6
—
Self refresh current
(L-version)
I _CC6
—
240
560
560
1000
24
16
mA CKE, S = V_IH,
t_CK = 12 ns
mA t_CK = min, BL = 4
mA
mA t_RC = min
mA V_IH ≥ V_CC – 0.2 V
V_IL ≤ 0.2 V
mA
1, 2, 4
1, 2, 5
3
8
Input leakage current
Output leakage current
I _LI
–10
10
I _LO
–10
10
µA 0 ≤ Vin ≤ V_CC
µA 0 ≤ Vout ≤ V_CC
DQ = disable
Output high voltage
V_OH
2.4
—
V
I_OH = –4 mA
Output low voltage
V_OL
—
0.4
V
I_OL = 4 mA
Notes: 1. I_CC depends on output load condition when the device is selected. I_CC (max) is specified at the
output open condition.
2. One bank operation.
3. Input signals are changed once per one clock.
4. Input signals are changed once per two clocks.
5. Input signals are changed once per four clocks.
6. After power down mode, CK0/CK1 operating current.
7. After power down mode, no CK0/CK1 operating current.
8. After self refresh mode set, self refresh current.
Data Sheet E0084H10
16