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DS1390 Datasheet, PDF (8/24 Pages) Maxim Integrated Products – Low-Voltage SPI/3-Wire RTCs with Trickle Charger
Low-Voltage SPI/3-Wire RTCs with
Trickle Charger
CAPACITANCE
(TA = +25°C)
PARAMETER
Capacitance on All Input Pins
Capacitance on All Output Pins
(High Impedance)
SYMBOL
CIN
CIO
CONDITIONS
MIN TYP MAX UNITS
10
pF
10
pF
WARNING: Under no circumstances are negative undershoots, of any amplitude, allowed when the device
is in write protection.
Note 1: Limits at -40°C are guaranteed by design and not production tested.
Note 2: All voltages are referenced to ground.
Note 3: The use of the 250Ω trickle-charge resistor is not allowed at VCC > 3.63V and should not be enabled. Use of the diode is
not recommended for VCC < 3.0V.
Note 4: Measured at VCC = typ, VBACKUP = 0V, register 0Fh = A5h.
Note 5: Measured at VCC = typ, VBACKUP = 0V, register 0Fh = A6h.
Note 6: Measured at VCC = typ, VBACKUP = 0V, register 0Fh = A7h.
Note 7: SCLK, DIN, CS on DS1390/DS1391; SCLK, and CE on DS1392/DS1393.
Note 8: DOUT, SQW/INT (DS1390/DS1393), SQW, and INT (DS1392).
Note 9: The RST pin has an internal 50kΩ (typ) pullup resistor to VCC.
Note 10: ICCA—SCLK clocking at max frequency = 4MHz for 3V and 3.3V versions; 1MHz for 1.8V version; RST (DS1391/DS1393)
inactive. Outputs are open.
Note 11: Specified with bus inactive.
Note 12: Measured with a 32.768kHz crystal attached to X1 and X2. Typical values measured at +25°C and 3.0VBACKUP.
Note 13: With 50pF load.
Note 14: Measured at VIH = 0.7 x VDD or VIL = 0.2 x VDD, 10ns rise/fall times.
Note 15: Measured at VOH = 0.7 x VDD or VOL = 0.2 x VDD. Measured from the 50% point of SCLK to the VOH minimum of SDO.
Note 16: The parameter tOSF is the time that the oscillator must be stopped for the OSF flag to be set over the voltage range of
0 ≤ VCC ≤ VCC(MAX) and 1.3V ≤ VBAT ≤ 5.5V.
Note 17: This delay applies only if the oscillator is enabled and running. If the EOSC bit is 1, the startup time of the oscillator is
added to this delay.
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