DS5002FP_1 Datasheet, PDF (29/29 Pages) Dallas Semiconductor – Secure Microprocessor Chip

DS5002FP
DATA SHEET REVISION SUMMARY
The following represent the key differences between 11/27/95 and 07/30/96 version of the DS5002FP
data sheet. Please review this summary carefully.
1. Change V_CC02 specification from V_LI-0.5 to V_LI-0.65 (PCN F62501).
2. Update mechanical specifications.
The following represent the key differences between 07/30/96 and 11/19/96 version of the DS5002FP
data sheet. Please review this summary carefully.
1. Change V_CC01 from V_CC-0.3 to V_CC-0.35.
The following represent the key differences between 11/19/96 and 06/12/97 version of the DS5002FP
data sheet. Please review this summary carefully.
1. PF signal moved from V_OL2 test specification to V_OL1. PCN No. (D72502)
2. AC characteristics for battery-backed SDI pulse specification added.
The following represent the key differences between 06/12/97 and 05/14/99 version of the DS5002FP
data sheet. Please review this summary carefully.
1. Reduced absolute maximum voltage to VCC + 0.5V.
2. Added note clarifying storage temperature specification is for non-battery-backed state.
3. Deleted I_BAT specification (Duplicate of I_LI specification).
4. Changed RRE min (industrial temp range) from 40 kΩ to 30 kΩ.
5. Changed VPFW max (industrial temp range) from 4.5V to 4.6V.
6. Added industrial specification for I_LI.
7. Reduced t_CE1HOV and t_CEHDV from 10 ns to 0 ns.
The following represent the key differences between 05/14/99 and 05/25/99 version of the DS5002FP
data sheet. Please review this summary carefully.
1. Minor revisions and approval.
29 of 29