DS5002FP_1 Datasheet, PDF (27/29 Pages) Dallas Semiconductor – Secure Microprocessor Chip

DS5002FP
NOTES:
All parameters apply to both commercial and industrial temperature operation unless otherwise noted.
1. All voltages are referenced to ground.
2. Maximum operating I_CC is measured with all output pins disconnected; XTAL1 driven with t_CLKR,
t_CLKF=10 ns, V_IL = 0.5V; XTAL2 disconnected; RST = PORT0 = V_CC, MSEL = V_SS.
3. Idle mode I_IDLE is measured with all output pins disconnected; XTAL1 driven with t_CLKR, t_CLKF =
10 ns, V_IL = 0.5V; XTAL2 disconnected; PORT0 = V_CC, RST = MSEL = V_SS.
4. Stop mode I_STOP is measured with all output pins disconnected; PORT0 = V_CC; XTAL2 not
connected; RST = MSEL = XTAL1 = V_SS.
5. Pin capacitance is measured with a test frequency - 1 MHz, t_A = 25°C.
6. I_CCO1 is the maximum average operating current that can be drawn from V_CCO in normal operation.
7. I_LI is the current drawn from V_LI input when V_CC = 0V and V_CCO is disconnected. Battery-backed
mode: 2.5V £ V_BAT £ 4.0; V_CC £ V_BAT; V_SDI should be £ V_ILS for I_BAT max.
8. V_CCO2 is measured with V_CC < V_LI, and a maximum load of 10 µA on V_CCO.
9. Crystal start-up time is the time required to get the mass of the crystal into vibrational motion
from the time that power is first applied to the circuit until the first clock pulse is produced by the
on-chip oscillator. The user should check with the crystal vendor for a worst case specification on
this time.
10. SDI is deglitched to prevent accidental destruction. The pulse must be longer than t_SPR to pass the
deglitcher, but SDI is not guaranteed unless it is longer than t_SPA.
11. V_IHS minimum is 2.0V or V_CCO, whichever is lower.
12. This parameter applies to industrial temperature operation.
13. PF pin operation is specified with V_BAT ³ 3.0V.
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