MTB02N03H8 Datasheet, PDF (11/11 Pages) Cystech Electonics Corp. – N-Channel Logic Level Enhancement Mode Power MOSFET

CYStech Electronics Corp.
DFN5×6 Dimension (N Forming)
Spec. No. : C575H8
Issued Date : 2012.05.09
Revised Date :2012.11.12
Page No. : 11/11
Marking:
Device Name
Date Code
B02
N03
8-8L-eLaedadpDowFNer5×p6akPlPaslatisctiPcaPckaacgkeage
C_CY_YSt_Sek_PaP_ca_kc_agk_eag_Ce_odC_eo_:d_He₈: H8
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
0.90
1.00 0.035 0.039 E2
3.18
3.54 0.125 0.139
b
0.35
0.45 0.014 0.018
H
0.51
0.71 0.020 0.028
c
0.21
0.34 0.008 0.013
K
1.10
-
0.043
-
D
-
5.10
-
0.201
L
0.51
0.71 0.020 0.028
D1
4.80
5.00 0.189 0.197 L1
0.06
0.20 0.002 0.008
D2
3.82
4.02 0.150 0.158 L2
-
0.10
-
0.004
e
1.17
1.37 0.046 0.054
p
1.00
1.20 0.039 0.047
E
5.90
6.10 0.232 0.240
θ
8°
12°
8°
12°
E1
5.70
5.80 0.224 0.228
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTB02N03H8
CYStek Product Specification