MTB02N03H8 Datasheet, PDF (10/11 Pages) Cystech Electonics Corp. – N-Channel Logic Level Enhancement Mode Power MOSFET

CYStech Electronics Corp.
DFN5×6 Dimension (G Forming)
Spec. No. : C575H8
Issued Date : 2012.05.09
Revised Date :2012.11.12
Page No. : 10/11
Marking:
Device Name
Date Code
B02
N03
8-L8e-LaedapdoDwFeNr5p×a6kPPlalastsicticPaPcakcakgae ge
CY_CS_Yte_Sk_PP_aca_kc_ak_ga_eg_Ce_oC_deod_: e_H:₈H8
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
0.80
1.00 0.031 0.039
E
5.70
5.90
0.224 0.232
A1
0.00
0.05 0.000 0.002
e
1.27 BSC
0.050 BSC
b
0.35
0.49 0.014 0.019
H
5.95
6.20
0.234 0.244
c
0.254 REF
0.010 REF
L1
0.10
0.18 0.004 0.007
D
4.90
5.10
0.193 0.201
G
0.60 REF
0.024 REF
F
1.40 REF
0.055 REF
K
4.00 REF
0.157 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
MTB02N03H8
CYStek Product Specification