MTA5D0P01H8 Datasheet, PDF (10/10 Pages) Cystech Electonics Corp. – P-Channel Enhancement Mode Power MOSFET

CYStech Electronics Corp.
DFN5×6 Dimension
Spec. No. : C044H8
Issued Date : 2017.07.25
Revised Date :
Page No. : 10/ 10
Marking:
Device Name
Date Code
A5D0
P01
8-Lead DFN5×6 Plastic Package
CYS Package Code : H8
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
DIM
Millimeters
Min.
Max.
Inches
Min.
Max.
A
0.90
1.10 0.035 0.043 E2
3.38
3.78 0.133 0.149
A1
0.00
0.05 0.000 0.002
e
1.27 BSC
0.050 BSC
b
0.33
0.51 0.013 0.020
H
0.41
0.61 0.016 0.024
C
0.20
0.30 0.008 0.012
K
1.10
-
0.043
-
D1
4.80
5.00 0.189 0.197
L
0.51
0.71 0.020 0.028
D2
3.61
3.96 0.142 0.156 L1
0.06
0.20 0.002 0.008
E
5.90
6.10
0.232 0.240
θ
8°
12°
8°
12°
E1
5.70
5.80 0.224 0.228
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTA5D0P01H8
CYStek Product Specification