CY8C38 Datasheet, PDF (98/100 Pages) Cypress Semiconductor – Programmable System-on-Chip (PSoC)

PRELIMINARY
PSoC^®3: CY8C38 Family Data Sheet
Figure 13-3. 68-Pin QFN 8x8 with 0.4 mm Pitch Package Outline (Sawn Version)
TOP VIEW
SIDE VIEW
BOTTOM VIEW
6
8
1
PIN 1 DOT
LASER MARK
8.000±0.100
5
2
5
1
0.900±0.100
0.200 REF
5
2
5
1
5.7±0.10
0.400 PITCH
PIN1 ID
R 0.20
6
8
1
5.7±0.10
0.20±0.05
SOLDERABLE
EXPOSED
PAD
1
7
1
8
3
5
3
4
3
0.400±0.1005
0.05 MAX
3
4
6.40 REF
1
7
1
8
NOTES:
1. HATCH AREA IS SOLDERABLE EXPOSED METAL.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.17g
4. ALL DIMENSIONS ARE IN MILLIMETERS
Figure 13-4. 100-Pin TQFP (14 x 14 x 1.4 mm) Package Outline
001-09618 *C
100
1
16.00±0.25 SQ
14.00±0.05 SQ
NOTE:
1. JEDEC STD REF MS-026
76
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE
BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH
75
3. DIMENSIONS IN MILLIMETERS
STAND-OFF
0.05 MIN.
0.15 MAX.
0° MIN.
R 0.08 MIN.
0.20 MAX.
0.25
GAUGE PLANE
0.50
TYP.
R 0.08 MIN.
0.20 MAX.
DETAIL A
0°-7°
0 0 12.0000
0.60±0.15
25
51
26
50
NOTE: PKG. CAN HAVE
SEATING PLANE
1.60 MAX.
0.08
0.20 MAX.
12°±1°
(8X)
1.40±0.05
SEE DETAIL A
OR
TOP LEFT CORNER CHAMFER
4 CORNERS CHAMFER
51-85048-*C
Document Number: 001-11729 Rev. *I
Page 98 of 100
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