MB39C831 Datasheet, PDF (36/40 Pages) Cypress Semiconductor – Ultra Low Voltage Boost Power Management IC for Solar/Thermal Energy Harvesting Datasheet

17. Package Dimensions
40-pin plastic QFN
(LCC-40P-M63)
40-pin plastic QFN
(LCC-40P-M63)
6.00±0.10
(.236±.004)
MB39C831
Lead pitch
Package width ×
package length
Sealing method
Mounting height
Weight
0.50 mm
6.00 mm × 6.00 mm
Plastic mold
0.90 mm MAX
0.10 g
4.50±0.10
(.177±.004)
INDEX AREA
6.00±0.10
(.236±.004)
4.50±0.10
(.177±.004)
0.45
(.017)
0.50(.020)
(TYP)
0.25±0.05
(.010±.002)
1PIN INDEX
R0.20(R.008)
0.40±0.05
(.016±.002)
0.035
+0.015
-0.035
(.0014^+-..00001046
)
(0.20(.008))
0.85±0.05
(.033±.002)
C _{2013 FUJITSU SEMICONDUCTOR LIMITED HMbC40-63Sc-1-1}
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Document Number: 002-08404 Rev *A
Page 36 of 40