STAR1000_09 Datasheet, PDF (18/21 Pages) Cypress Semiconductor – 1M Pixel Radiation Hard CMOS Image Sensor

STAR1000
Soldering and Handling
Soldering and Handling Conditions
Take special care when soldering image sensors onto a circuit
board. Prolonged heating at elevated temperatures may result in
deterioration of the performance of the sensor. The following
recommendations are made to ensure that sensor performance
is not compromised during end users' assembly processes.
Board Assembly
The STAR1000 is very sensitive to ESD. Device placement onto
boards should be done in accordance with strict ESD controls for
Class 0, JESD22 Human Body Model, and Class A, JESD22
Machine Model devices. Assembly operators need to always
wear all designated and approved grounding equipment;
grounded wrist straps at ESD protected workstations are recom-
mended including the use of ionized blowers. All tools should be
ESD protected.
Manual Soldering
When a soldering iron is used the following conditions should be
observed:
Use a soldering iron with temperature control at the tip. The
soldering iron tip temperature should not exceed 350°C.
The soldering period for each pin should be less than five
seconds.
Reflow Soldering
Reflow soldering is not allowed.
Precautions and Cleaning
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with antireflection filters may be harmed by the
flux. Avoid mechanical or particulate damage to the cover glass.
Use isopropyl alcohol (IPA) as a solvent for cleaning the image
sensor glass lid. When using other solvents, confirm whether the
solvent does not damage the package and/or glass lid.
RoHS (lead free) Compliance
This paragraph reports the use of Hazardous chemical
substances as required by the RoHS Directive (excluding
packing material).
Table 9. Chemical Substances in STAR250 Sensor
Chemical Substance
Any intentional content
If there is any intentional content, in which portion is
it contained?
Lead
NO
-
Cadmium
NO
-
Mercury
NO
-
Hexavalent chromium
NO
-
PBB (Polybrominated biphenyls)
NO
-
PBDE (Polybrominated diphenyl ethers)
NO
-
Information on Lead Free Soldering
The product cannot withstand a lead free soldering process.
Reflow or wave soldering is not recommended. Hand soldering
is needed for this part type. Solder 1 pin on each side and let the
sensor cool down for minimum 1 minute before continuing.
Note: "Intentional Content" is defined as any material
demanding special attention that is contained into the inquired
product by these cases:
1. A case that the above material is added as a chemical compo-
sition into the inquired product intentionally in order to produce
and maintain the required performance and function of the
intended product
2. A case that the above material, which is used intentionally in
the manufacturing process, is contained in or adhered to the
inquired product.
The following case is not treated as "intentional content":
A case that the above material is contained as an impurity into
raw materials or parts of the intended product. The impurity is
defined as a substance that cannot be removed industrially, or it
is produced at a process like chemical composing or reaction
and it cannot be removed technically.
Document Number: 38-05714 Rev. *C
Page 18 of 21
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