CPC7594 Datasheet, PDF (19/20 Pages) Clare, Inc. – Line Card Access Switch

3.2 Printed-Circuit Board Layout
3.2.1 DFN
0.35
(0.014)
1.05
(0.041)
5.80
(0.228)
0.80
(0.031)
DIMENSIONS
mm
(inches)
NOTE: As the metallic pad on the bottom of the DFN
package is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area to maintain minimum
creepage and clearance values.
3.3 Tape and Reel Packaging
3.3.1 DFN
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
3.2.2 SOIC
2.00
(0.079)
0.60
(0.024)
Pin 1
CPC7594
1.27
(0.050)
9.40
(0.370)
DIMENSIONS
mm
(inches)
B =7.24 + 0.10
0
(0.285 + 0.004)
W=16.00 + 0.30
(0.630 + 0.012)
Embossed
Carrier
Embossment
K₀=1.61 + 0.10
(0.063 + 0.004)
P=12.00 + 0.10
(0.472 + 0.004)
A₀=6.24 + 0.10
(0.246 + 0.004)
User Direction of Feed
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
R03
www.clare.com
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