English
Language : 

DEMO-ATF-5X1M4E Datasheet, PDF (11/16 Pages) Broadcom Corporation. – Low Noise Enhancement Mode Pseudomorphic HEMT in a Miniature Leadless Package
Electrostatic Sensitivity
FETs and RFICs are electrostatic dis‑
charge (ESD) sensitive devices. Avago
devices are manufactured using
a very robust and reliable PHEMT
process, however, permanent dam‑
age may occur to these devices if
they are subjected to high-energy
electrostatic discharges. Electrostatic
charges as high as several thousand
volts (which readily accumulate on the
human body and on test equipment)
can discharge without detection and
may result in failure or degradation in
performance and reliability.
250
200
Electronic devices may be subjected
to ESD damage in any of the follow‑
ing areas:
• Storage & handling
• Inspection
• Assembly & testing
• In-circuit use
The ATF-541M4 is an ESD Class 1
device. Therefore, proper ESD pre‑
cautions are recommended when
handling, inspecting, testing, and
assembling these devices to avoid
damage.
TMAX
Any user-accessible points in wireless
equipment (e.g. antenna or battery
terminals) provide an opportunity for
ESD damage.
For circuit applications in which the
ATF-541M4 is used as an input or
output stage with close coupling
to an external antenna, the device
should be protected from high volt‑
age spikes due to human contact with
the antenna. A good practice, illus‑
trated in Figure 23, is to place a shunt
inductor or RF choke at the antenna
connection to protect the receiver
and transmitter circuits. It is often ad‑
vantageous to integrate the RF choke
into the design of the diplexer or T/R
switch control circuitry.
150
Reflow
Zone
100
Preheat
Zone
Cool Down
Zone
50
0
0
60
Figure 21. Leaded Solder Reflow Profile.
120
180
TIME (seconds)
Figure 23. In-circuit ESD Protection.
240
300
350
Peak Temperature
300
Min. 240 C
Max. 255 C
250
221
200
Reflow Time
Min. 60s
Max. 90s
150
100
Preheat 130 –170 C
Min. 60s
50
Max. 150s
0
0 30 60 90 120 150 180 210 240 270 300 330 360
TIME (seconds)
Figure 22. Lead-free Solder Reflow Profile.
11