HCPL-800J Datasheet, PDF (8/18 Pages) AVAGO TECHNOLOGIES LIMITED – Under-Voltage Detection

Electrical Specifications (Cont.)
Unless otherwise noted, for sinusoidal waveform input and reference resistor R_ref = 24 kΩ, all typical values are at T_A =
25°C, V_CC1 = 5 V, V_CC2 = 5 V; all Minimum/Maximum specifications are at Recommended Operating Conditions.
Transmitter
Parameter
Transmit Enable Threshold
Voltage
Symbol
V_th, T_x-en
Min. Typ. Max. Unit Test Condition
0.8
2.4 V
Fig. Note
Set-up Time (Tx-PD-out)
t_s, T_x
AGC Settling Time
t_AGC
10
µs
V_Tx-en = 5 V, I_Tx-in = 250 µA_PP, f 21
1
180
µs
= 132 kHz,
Tx-PD-out no load
2
Tx Photodetector Output
Voltage (Tx-PD-out)
2nd Harmonic Distortion
Tx-PD-out)
3rd Harmonic Distortion
(Tx-PD-out)
HD2_TxPD
HD3_TxPD
2.8 3.3 3.6
-50
-62
V
V_Tx-en = 5 V, I_Tx-in = 250 µA_PP, f 7, 8, 9
= 132 kHz, T_A = 25°C
dB V_Tx-en = 5 V, I_Tx-in = 250 µA_PP, f 10, 22
= 132 kHz, Tx-PD-out load
1 kΩ
dB
Bandwidth (Tx-PD-out)
Tx Photodetector Output
Impedance (Tx-PD-out)
BW_TxPD
Z_O, _TxPD
1
MHz V_Tx-en = 5 V, I_Tx-in = 250µA_PP
1
Ω
V_Tx-en = 5 V, f = 132 kHz
Line Driver (LD)
Power Supply (V_CC2)
Rejection Ratio
Input Impedance
DC Biased Voltage
Gain
PSRR
Z_{I, LD}
V_Bias, LD
G_T2
55
10
2.27
1.8 2
2.2
dB 50 Hz ripple,
V_ripple = 200 mV_PP
kΩ V_Tx-en = 5 V, f = 132 kHz
V
V_Tx-en = 5 V
V/V V_Tx-en = 5 V, f = 132 kHz, Tx- 11
out no load
2nd Harmonic Distortion
(Tx-out)
3rd Harmonic Distortion
(Tx-out)
HD2_LD
HD3_LD
-65 -60
-75 -65
dB
V_Tx-en = 5 V, V_Tx-out = 3.6 V_PP,
12, 13,
f = 132 kHz, Tx-out load 50 14, 15,
dB ^{Ω, TA = 25°C}
16, 23
Output Impedance (Tx-out)
Z_{O, LD}
0.5
Ω
V_Tx-en = 5 V, f = 132 kHz
7.5
kΩ V_Tx-en = 0 V, f = 132 kHz
Short-Circuit Output Current I_OS
2
A_PP
V_Tx-en = 5 V,
3, 4
V_Tx-LD-in = 1.8 V_PP,
f = 132 kHz, t_P ≤ 50 µs
Notes:
1. Time from transmit is enabled (V_Tx-en is set to logic high) until output (Tx-PD-out) is available. See Figure 26 in the Application Information
section.
2. Time from output (Tx-PD-out) is available until Tx-PD-out signal reaches 66% of its steady state level. See Figure 26 in the Application
Information section.
3. To keep the junction temperature as close to the ambient temperature as possible, pulse testing method is used. The device is transmit-
enabled within the pulse duration time, t_P. Thermal effects must be considered separately.
4. Maximum power dissipation in Control side and Line side IC’s needs to be limited to ensure that their respective junction temperature is less
than 125°C. The maximum permissible power dissipation is dependent on the thermal impedance and the ambient temperature. Details on
the typical thermal impedances are given in the Package Characteristics. Further details on applying this to an actual application can be
found in the Application Information section under Thermal Considerations.
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