AT24C02C Datasheet, PDF (15/23 Pages) ATMEL Corporation – Two-wire Serial Electrically Erasable and Programmable Read-only Memory

Atmel AT24C02C
11. Ordering Codes
Atmel AT24C02C Ordering Information
Ordering Code
AT24C02C-PUM (Bulk form only)
AT24C02C-SSHM-B⁽¹⁾ (NiPdAu Lead Finish)
AT24C02C-SSHM-T⁽²⁾ (NiPdAu Lead Finish)
AT24C02C-XHM-B⁽¹⁾ (NiPdAu Lead Finish)
AT24C02C-XHM-T⁽²⁾ (NiPdAu Lead Finish)
AT24C02C-MAHM-T⁽²⁾ (NiPdAu Lead Finish)
AT24C02C-STUM-T⁽²⁾
AT24C02C-CUM-T⁽²⁾
AT24C02C-WWU11⁽³⁾
Voltage
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
Package
8P3
8S1
8S1
8A2
8A2
8Y6
5TS1
8U3-1
Die Sale
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
Industrial Temperature
(–40°C to 85°C)
Notes:
1. “-B” denotes bulk
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, UDFN, SOT23, and VFBGA = 5K per reel
3. For Wafer sales, please contact Atmel Sales
8P3
8S1
8A2
8Y6
5TS1
8U3-1
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Dual No Lead Package (UDFN)
5-lead, 2.90mm x 1.60mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Array Package (VFBGA)
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8700D–SEEPR–8/10