AT17LV65A_06 Datasheet, PDF (12/18 Pages) ATMEL Corporation – FPGA Configuration EEPROM Memory

21. Thermal Resistance Coefficients⁽¹⁾
Package Type
8P3 Plastic Dual Inline Package (PDIP)
20J
Plastic Leaded Chip Carrier (PLCC)
32A
Thin Plastic Quad Flat Package
(TQFP)
44J
Plastic Leaded Chip Carrier (PLCC)
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
θ_JC [°C/W]
θ_JA [°C/W]⁽²⁾
AT17LV65A/
AT17LV128A/
AT17LV256A
35
90
–
–
AT17LV512A/
AT17LV010A
37
107
35
90
–
–
AT17LV002A
35
90
15
50
Notes: 1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
12 AT17LV65A/128A/256A/512A/002A
2322G–CNFG–03/06