TCS3472_17 Datasheet, PDF (32/40 Pages) ams AG – Red, Green, Blue (RGB), and Clear Light

TCS3472 − Soldering &Storage Information
Soldering & Storage
Information
Figure 39:
Solder Reflow Profile
Soldering Information
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate. The process,
equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Parameter
Average temperature gradient in preheating
Soak time
Time above 217 ºC (T₁)
Time above 230 ºC (T₂)
Time above T_peak - 10 ºC (T₃)
Peak temperature in reflow
Temperature gradient in cooling
Reference
t_soak
t₁
t₂
t₃
T_peak
Device
2.5 ºC/s
2 to 3 minutes
Max 60 s
Max 50 s
Max 10 s
260 ºC
Max -5 ºC/s
Figure 40:
Solder Reflow Profile Graph
(s)
Note(s):
1. Not to scale – for reference only.
Page 32
Document Feedback
ams Datasheet
[v1-02] 2016-Feb-08