PALCE16V8 Datasheet, PDF (26/26 Pages) Advanced Micro Devices – EE CMOS 20-Pin Universal Programmable Array Logic

TYPICAL THERMAL CHARACTERISTICS
/4 Devices (PALCE16V8H-10/4)
Measured at 25°C ambient. These parameters are not tested.
Parameter
Symbol
θjc
θja
θjma
Parameter Description
Thermal Impedance, Junction to Case
Thermal Impedance, Junction to Ambient
Thermal Impedance, Junction to Ambient with Air Flow
200 Ifpm air
400 Ifpm air
600 Ifpm air
800 Ifpm air
AMD
Typ
PDIP
25
71
61
55
51
47
PLCC
22
64
55
51
47
45
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
/5 Devices (PALCE16V8H-7/5)
Measured at 25°C ambient. These parameters are not tested.
Parameter
Symbol Parameter Description
Typ
PDIP
PLCC
Unit
θjc
Thermal Impedance, Junction to Case
29
θja
Thermal Impedance, Junction to Ambient
70
θjma
Thermal Impedance, Junction to Ambient with Air Flow 200 Ifpm air
64
400 Ifpm air
58
23
°C/W
61
°C/W
53
°C/W
47
°C/W
600 Ifpm air
53
44
°C/W
800 Ifpm air
X
X
°C/W
Plastic θjc Considerations
The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the
package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
PALCE16V8 Family
2-61