EP1S30F780C7 Datasheet, PDF (836/864 Pages) Altera Corporation – Stratix Device Handbook, Volume 1

Package Outlines
1,020-Pin FineLine BGA - Flip Chip
■ All dimensions and tolerances conform to ASME Y14.5M - 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
Tables 13–11 and 13–12 show the package information and package
outline figure references, respectively, for the 1,020-pin FineLine BGA
packaging.
Table 13–11. 1,020 FineLine BGA Package Information
Description
Specification
Ordering code reference
F
Package acronym
FineLine BGA
Substrate material
BT
Solder ball composition
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC outline reference
MS-034 variation: AAP-1
Maximum lead coplanarity
0.008 inches (0.20 mm)
Weight
11.5 g
Moisture sensitivity level
Printed on moisture barrier bag
Table 13–12. 1,020-Pin FineLine BGA Package Outline Dimensions
Symbol
Millimeters
Min.
Nom.
Max.
A
–
–
3.50
A1
0.30
–
–
A2
0.25
–
3.00
A3
–
–
2.50
D
33.00 BSC
E
33.00 BSC
b
0.50
0.60
0.70
e
1.00 BSC
13–12
Stratix Device Handbook, Volume 2
Altera Corporation
July 2005