EP53A8LQA Datasheet, PDF (18/21 Pages) Altera Corporation – Integrated Inductor

Layout Recommendations
Figure 10 shows critical components and layer
1 traces of a recommended minimum footprint
EP53A8LQA/EP53A8HQA layout with
ENABLE tied to V_IN. Alternate ENABLE
configurations, and other small signal pins
need to be connected and routed according to
specific customer application. Please see the
Gerber
files
on
the
Altera
website www.altera.com/enpirion for exact
dimensions and other layers. Please refer to
Figure 10 while reading the layout
recommendations in this section.
Recommendation 1: Input and output filter
capacitors should be placed on the same side
of the PCB, and as close to the EP53A8xQA
package as possible. They should be
connected to the device with very short and
wide traces. Do not use thermal reliefs or
spokes when connecting the capacitor pads to
the respective nodes. The +V and GND traces
between the capacitors and the EP53A8xQA
should be as close to each other as possible
so that the gap between the two nodes is
minimized, even under the capacitors.
Recommendation 2: Input and output grounds
are separated until they connect at the PGND
pins. The separation shown on Figure 10
between the input and output GND circuits
helps minimize noise coupling between the
converter input and output switching loops.
Recommendation 3: The system ground
plane should be the first layer immediately
below the surface layer. This ground plane
should be continuous and un-interrupted below
the converter and the input/output capacitors.
Please see the Gerber files on the Altera
website www.altera.com/enpirion.
EP53A8LQA/EP53A8HQA
Figure 10. Top PCB Layer Critical Components
and Copper for Minimum Footprint
Recommendation 4: Multiple small vias
should be used to connect the ground traces
under the device to the system ground plane
on another layer for heat dissipation. The drill
diameter of the vias should be 0.33mm, and
the vias must have at least 1 oz. copper plating
on the inside wall, making the finished hole
size around 0.20-0.26mm. Do not use thermal
reliefs or spokes to connect the vias to the
ground plane. It is preferred to put these vias
under the capacitors along the edge of the
GND copper closest to the +V copper. Please
see Figure 10. These vias connect the
input/output filter capacitors to the GND plane
and help reduce parasitic inductances in the
input and output current loops. If the vias
cannot be placed under C_IN and C_OUT, then put
them just outside the capacitors along the
GND. Do not use thermal reliefs or spokes to
connect these vias to the ground plane.
Recommendation 5: AVIN is the power supply
for the internal small-signal control circuits. It
should be connected to the input voltage at a
quiet point. In Figure 10 this connection is
made with RAVIN at the input capacitor close
to the V_IN connection.
10366
July 21, 2015
www.altera.com/enpirion, Page 18
Rev D