ADSP-TS202S Datasheet, PDF (36/40 Pages) Analog Devices – TigerSHARC Embedded Processor

ADSP-TS202S
ENVIRONMENTAL CONDITIONS
The ADSP-TS202S processor is rated for performance over the
extended commercial temperature range, T_CASE = –40°C to
85°C.
Thermal Characteristics
The ADSP-TS202S processor is packaged in a 25 mm × 25 mm
thermally enhanced Ball Grid Array (BGA_ED). The ADSP-
TS202S processor is specified for a case temperature (T_CASE). To
ensure that the T_CASE data sheet specification is not exceeded, a
heatsink and/or an air flow source may be used.
Preliminary Technical Data
Table 27 shows the thermal characteristics of the
25 mm × 25 mm BGA_ED package.
Table 27. Thermal Characteristics
for 25 mm × 25 mm Package
Parameter
θ_JA
θ_JC
θ_JB
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
–
–
Typical
19.6
15.4
13.7
0.7
8.3
Units
°C/W
°C/W
°C/W
°C/W
°C/W
576-BALL BGA_ED PIN CONFIGURATIONS
Figure 43 shows a summary of pin configurations for the 576-
ball BGA_ED package and Table 28 lists the signal-to-ball
assignments.
2
4
6
8
10
12
14
16
18
20
22
24
1
3
5
7
9
11
13
15
17
19
21
23
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
KEY:
SIGNAL
V_DD
V_{DD_IO}
V_{DD_DRAM}
V_{DD_A}
V_REF
V_SS
TOP VIEW
Figure 43. 576-ball BGA_ED Pin Configurations¹ (top view, Summary)
1 _{For a more detailed pin summary diagram, see the EE-179: ADSP-TS201S System Design Guidelines on the Analog Devices website (www.analog.com)}
Rev. PrB | Page 36 of 40 | December 2003