SSM2604 Datasheet, PDF (26/28 Pages) Analog Devices – Low Power Audio Codec

SSM2604
OUTLINE DIMENSIONS
4.00
BSC SQ
PIN 1
INDICATOR
TOP VIEW
1.00 ^{12° MAX}
0.85
0.80
SEATING
PLANE
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.60 MAX
0.60 MAX
3.75
BSC SQ
0.50
BSC
0.50
0.40
0.30
15 ₁₆
20
1
EXPOSED
PAD
(BOTTOM VIEW)
10
11
5
6
PIN 1
INDICATOR
2.65
2.50 SQ
2.35
0.25 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 28. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
SSM2604CPZ-R2¹
SSM2604CPZ-REEL¹
SSM2604CPZ-REEL7¹
SSM2604-EVALZ¹
1 _{Z = RoHS Compliant Part.}
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Package Option
CP-20-4
CP-20-4
CP-20-4
Rev. 0 | Page 26 of 28