ADSP-BF607BBCZ-5 Datasheet, PDF (108/112 Pages) Analog Devices – Blackfin Dual Core Embedded Processor

ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609
OUTLINE DIMENSIONS
Dimensions for the 19 mm  19 mm CSP_BGA package in
Figure 65 are shown in millimeters.
A1 BALL
CORNER
19.10
19.00 SQ
18.90
TOP VIEW
DETAIL A
1.50
1.36
1.21
16.80
BSC SQ
0.80
BSC
1.10 REF
22 20 18 16 14 12 10 8 6 4 2
21 19 17 15 13 11 9 7 5 3 1
A1 BALL
CORNER
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
BOTTOM VIEW
DETAIL A
1.11
1.01
0.91
0.35 NOM
0.30 MIN
SEATING
PLANE
0.50
COPLANARITY
0.45
0.20
0.40
BALL DIAMETER
COMPLIANT TO JEDEC STANDARDS MO-275-PPAB-2.
Figure 65. 349-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-349-1)
Dimensions shown in millimeters
SURFACE-MOUNT DESIGN
Table 70 is provided as an aid to PCB design. For industry-stan-
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 70. BGA Data for Use with Surface-Mount Design
Package
BC-349-1
Package 
Ball Attach Type
Solder Mask Defined
Package 
Solder Mask Opening
0.4 mm Diameter
Package 
Ball Pad Size
0.5 mm Diameter
Rev. 0 | Page 108 of 112 | June 2013