7022BG Datasheet, PDF (87/116 Pages) Aavid, Thermal Division of Boyd Corporation – Channel style heat sink with folded back fins

Hi-Flow® *
Aavid Thermalloy has added a phase change
pad to its line-up. These pads provide low
thermal resistance and electrical isolation
for low pressure spring mount applications.
Above the phase change temperature the
material flows to fill in surface irregularities
and maximize the heat conduction path.
TO-3
2Xø 3.56
(0.140)
41.91
(1.650)
Interface Material/Pads
TO-220
12.70
(0.500)
3.73 DIA
(0.147)
TO-218
18.80
(0.740)
2.69 DIA
(0.160)
19.05
(0.750)
14.30
(0.563)
21.84
(0.860)
16.76
(0.660)
2X ø 2.36
(0.093)
ORDERING INFORMATION
example 12 digit part 530101B _ 5150G
Ordering code
The shape and hole pattern of the heat sink will determine the shape and hole
pattern of the pad. If you are ordering a heat sink which mounts to a semicon-
ductor on both sides, the ordering code for two pads should be used. To order
additional Hi-Flow® pads separate, or factory applied variations please contact
an Aavid sales rep for inquiries.
Ordering code Description
0
No pads
7
One Hi-Flow® pad
8
Two Hi-Flow® pads
* Hi-Flow® is a registered trademark of the Bergquist Company
28.96
(1.140)
MATERIAL PROPERTIES
Reinforcement carrier
Polymide
Thickness
0.127 (0.005)
Continuous use temp (°C)
150
Phase change temp(°C)
55
Dielectric breakdown voltage (Vac) 5000
Dielectric constant (1000 Hz)
4.5
Volume resistivity (Ohm-meter)
1012
Thermal impedance vs. pressure
Pressure
10
25
50
200
TO-220 Thermal performance (ºC/W) 1.15 1.14 1.12 1.1
Alignment Pads
Solderable alignment pads are an innovative
way to attach the heat sink to your transistor that
could cut your assembly time by more than half.
Alignment pads provide cost effective solderability,
while providing numerous additional benefits.
Alignment pads are factory applied and can be
bought separately as well. Please refer to accessory
Index D on page 85.
ORDERING INFORMATION
example
Thermalloy origin part 7022B–8223–CL03 G
A
B
C
Suffix
8223-CL03G
8241-CL11G
Device
TO-220
TO-218
Figure
B
A
A = Model number
B = Alignment pad
C = RoHS compliant
Typical installation
Shown with part number 8241-CL11
Figure A
30.48
(1.200)
13.21
(0.520)
Figure B
7.62
(0.300)
11.68
(0.460)
25.02
(0.985)
3.10
(0.122)
25.40
(1.000)
0.76
(0.030)
5.08 ^21.84
(0.200)(0.860)
3.25
(0.128)
9.40
(0.370)
14.22
(0.560)
17.02
(0.670)
20.07
(0.790)
0.76
(0.030)
0.51
(0.020) ^3.18
TYP THK ^(0.125)
21.84
(0.860)
5.08
(0.200)
Recommended hole pattern for 8223-CL03G
Recommended hole pattern for 8241-CL11G
CL1
CLIP ASSEMBLY
PLATED THRU HOLE PER
DEVICE MANUFACTURERS
RECOMMENDATION
2.95 DIA PLATED
(0.116) THRU HOLE
2.54
(0.100)
2.54
(0.100)
7.37
(0.290)
14.73
(0.580)
1.60 DIA PLATED
(0.063) THRU HOLE
TYP(3)
2.95 DIA PLATED
(0.116) THRU HOLE
TYP(2)
5.46
(0.215)
12.70
(0.500)
25.40
(1.000)
5.46
(0.215)
www.aavidthermalloy.com
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