7022BG Datasheet, PDF (54/116 Pages) Aavid, Thermal Division of Boyd Corporation – Channel style heat sink with folded back fins

54
TO-220 & TO-218 & TO-247 Heat Sinks
5301 High rise style heat sink features twisted fins and Wave-On^TM solderable mounts
Grease
Epo^& xy
page112
Mounting
Kits
page 99
BASE PART
FIGURE A
FIGURE B
10.16
(0.400)
24.13
(0.950)
44.45
(1.750)
High rise style heat sink features
twisted fins and Wave-On^TM solder-
able mounts for easy attachment
to the PC card. Models include thru
holes on one side to attach devices
using standard hardware and dittins
with special slots on the other for
easy device attachment using a con-
venient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
44.45
(1.750)
"A"
7.50
(0.295)
7.62
(0.300)
2.54
(0.100)
3.00
(0.118)
4.24
(0.167)
14.99
(0.590)
ø 3.20
(0.126)
THRU
30.61
(1.205)
CLIP 50
4.06
(0.160)
TYP
12.70
(0.500)
6.60
(0.260)
ø 2.79 x 0.76
(0.110) (0.030)
HIGH DITTIN
1.57
(0.062)
30.61
(1.205)
CLIP 62
4.06
(0.160)
TYP
12.70
(0.500)
6.60
(0.260)
Ø 2.79 x 0.76
(0.110) (0.030)
2X HIGH DITTIN
1.57
(0.062)
2.54
(0.100)
3.48
(0.137)
12.45
(0.490)
14.99
(0.590)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
2.54
(0.100)
12.45
(0.490)
ORDERING INFORMATION
Part Number Description
530101B00100G Heat sink twisted fin
530101B00150G With device clip #50
530102B00100G Heat sink twisted fin
530102B00150G With device clip #50
530161B00162G With two device clips #62
530162B00162G With two device clips #62
Device
Figure “A” Dim
TO-218, TO-247
21.08 (0.830)
TO-218, TO-247
A 21.08 (0.830)
TO-220
18.29 (0.720)
TO-220
A 18.29 (0.720)
Dual TO-218, TO-247 B 21.08 (0.830)
Dual TO-220
B 18.29 (0.720)
Dia of PCB
Plated Thru
Hole for Tabs
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
4.75 (0.187)
For additional options see page 82
5308 High rise style heat sink features twisted fins and solderable tabs
0
100
Air Velocity—Feet Per Minute
200 400 600 800
80
60
40
20
0
0
4
8
12
16
530161 or 530162
530101 or 530102
Heat Dissipated—Watts
1000
5
4
3
2
1
0
20
Grease
Epo^& xy
page112
Mounting
Kits
page 99
BASE PART
FIGURE A
FIGURE B
High rise style heat sink features
twisted fins and solderable tabs
for easy attachment to the PC card.
Models include thru holes on one
side to attach devices using stan-
dard hardware and dittins with
special slots on the other for easy
device attachment using a conven-
ient spring clip. Dual models use
two dittins and clips to locate and
attach devices.
RECOMMENDED
HOLE PATTERN
ø 2.95 THRU 2x
(0.116)
43.13
(1.698)
45.72
(1.800)
44.45
(1.750)
7.62
"A"
(0.300)
10.16
(0.400)
2.54
(0.100)
3.00
(0.118)
14.99 14.99
(0.590) (0.590)
22.90
(0.900)
46.74
(1.841)
ø 3.20
(0.126)
30.61
(1.205)
CLIP 50
4.06
(0.160)
TYP
12.70
(0.500)
6.60
(0.260)
ø 2.79 x 0.76
(0.110) (0.030)
HIGH DITTIN
3.48
(0.137)
12.45
(0.490)
Material: 1.60 (0.063) Thick Aluminum
Finish: Black Anodize
30.61
(1.205)
CLIP 62
4.06
(0.160)
TYP
12.70
(0.500)
6.60
(0.260)
ø 2.79 X 0.76
(0.110) (0.030)
2X HIGH DITTIN
12.45
(0.490)
ORDERING INFORMATION
Part Number Description
530801B05100G Heat sink twisted fin and solderable tabs
530801B05150G With device clip #50
530802B05100G Heat sink twisted fin and solderable tabs
530802B05150G With device clip #50
530861B05162G With two device clips #62
530862B05162G With two device clips #62
For additional options see page 82
Device
TO-218, TO-247
TO-218, TO-247
TO-220
TO-220
Dual TO-218, TO-247
Dual TO-220
Figure
A
A
B
B
“A” Dim
21.08 (0.830)
21.08 (0.830)
18.29 (0.720)
18.29 (0.720)
21.08 (0.830)
18.29 (0.720)
Dia of PCB
Plated Thru
Hole for Tabs
2.95 (0.116)
2.95 (0.116)
2.95 (0.116)
2.95 (0.116)
2.95 (0.116)
2.95 (0.116)
0
100
Air Velocity—Feet Per Minute
200 400 600 800
80
60
40
20
0
0
4
8
12
16
530861 or 530862
530801 or 530802
Heat Dissipated—Watts
1000
5
4
3
2
1
0
20
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