7022BG Datasheet, PDF (24/116 Pages) Aavid, Thermal Division of Boyd Corporation – Channel style heat sink with folded back fins

SMT
5731 Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
Packaging
573100D00010G 13" Reel, 250 per reel
573100D00000G Bulk, 500 per bag
See page 25 for tape and reel information
0
100
80
60
40
20
0
0.0
Air Velocity—Feet Per Minute
200 400 600 800
0.5 1.0 1.5 2.0
Heat Dissipated—Watts
1000
25
20
15
10
5
0
2.5
8.00
(0.315)
22.86
(0.900)
10.16
(0.400)
8.13
(0.320)
1.3
(0.05)
10.41
(0.410)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
5733 Surface mount heat sink for D² PAK (TO-263) package semiconductors
24
Surface mount heat sink for D² PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
573300D00010G
573300D00000G
Packaging
13" Reel, 250 per reel
Bulk, 500 per bag
See page 25 for tape and reel information
0
50
40
30
20
10
0
0.0
Air Velocity—Feet Per Minute
200 400 600 800
0.5 1.0 1.5 2.0
Heat Dissipated—Watts
1000
20
16
12
8
4
0
2.5
12.70
(0.500)
26.16
(1.030)
10.16
(0.400)
1.3
(0.05)
12.70
(0.500)
7.37
(0.290)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
7106 Surface mount heat sink for D² PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Surface mount heat sink for D² PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number Packaging
7106D/TRG
13" Reel, 200 per reel
7106DG
Bulk, 500 per bag
See page 25 for tape and reel information
0
100
80
60
40
20
0
0
Air Velocity—Feet Per Minute
200 400 600 800
1
2
3
4
Heat Dissipated—Watts
1000
10
8
6
4
2
0
5
14.99
(0.590)
5.33
(0.210)
10.92 14.99
(0.430) (0.590)
25.91
(1.020)
10.16
(0.400)
7.62
(0.300)
9.52
(0.375)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure C on page 26 for board footprint information
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