CC1206ZRY5V7BB475 Datasheet, PDF (11/14 Pages) YAGEO Corporation – SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS

Product specification 11
Surface-Mount Ceramic Multilayer Capacitors ^{General Purpose & High Cap.}
Y5V
14
6.3 V to 50 V
TEST
Bond
strength of
plating on
end face
TEST METHOD
IEC 60384- 4.8
21/22
PROCEDURE
Mounting in accordance with IEC 60384-22
paragraph 4.3
Conditions: bending 1 mm at a rate of 1 mm/s,
radius jig 340 mm
REQUIREMENTS
No visible damage
<General purpose series>
∆C/C
Class2:
Y5V: ±10%
<High Capacitance series>
∆C/C
Class2:
Y5V: ±10%
Resistance to
soldering
heat
Solderability
4.9 Precondition: 150 +0/–10 °C for 1 hour, then keep Dissolution of the end face plating shall not
for 24 ±1 hours at room temperature
exceed 25% of the length of the edge
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 ^concerned
minute
Preheating: for size >1206: 100 °C to 120 °C for 1 ^{<General purpose series>}
minute and 170 °C to 200 °C for 1 minute
∆C/C
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Class2:
Y5V: ±20%
Recovery time: 24 ±2 hours
<High Capacitance series>
∆C/C
Class2:
Y5V: ±20%
D.F. within initial specified value
R_ins within initial specified value
4.10 Preheated the temperature of 80 °C to 140 °C and The solder should cover over 95% of the
maintained for 30 seconds to 60 seconds.
critical area of each termination
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for leadfree containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
Jul 29, 2010 V.5
www.yageo.com