XQ4000XL Datasheet, PDF (21/22 Pages) Xilinx, Inc – Ceramic and plastic packages

R
QPRO XQ4000XL Series QML High-Reliability FPGAs
Ordering Information
Example for QPRO™ military temperature part:
Mil-PRF-38535
(QML) Processed
XQ 4062XL -3 PG 475 M
Device Type
XQ4085XL
XQ4062XL
XQ4036XL
XQ4013XL
Speed Grade
-3
-1 (XQ4085XL only)
Temperature Range
M = Military Ceramic (T_C = –55^oC to +125 ^oC)
N = Military Plastic (T_J = –55°C to +125°C)
Number of Pins
Package Type
CB = Top Brazed Ceramic Quad Flat Pack
PG = Ceramic Pin Grid Array
PQ/HQ = Plastic Quad Flat Back
BG = Plastic Ball Grid Array
Example for SMD part:
Generic Standard
Microcircuit Drawing (SMD)
Prefix
Device Type
XQ4013XL = 98513
XQ4036XL = 98510
XQ4062XL = 98511
XQ4085XL = 99575
5962 98511 01 Q X C
Speed Grade
01 = -3 for XQ4103XL/4036XL/4062XL
01 = -1 for XQ4085XL
Lead Finish
C = Gold
B = Solder
Package Type
X = Pin Grid
Y = Ceramic Quad Flat Pack (Base Mark)
Z = Ceramic Quad Flat Pack (Lid Mark)
T = Plastic Quad Flat Pack
U = Plastic Ball Grid
Q = QML Certified
N = QML Plastic (N - Grade)
Revision History
The following table shows the revision history for this document
Date
05/01/98
01/01/99
02/09/00
06/25/00
Version
1.0
1.1
1.2
1.3
Description
Original document release.
Addition of new packages, clarification of parameters.
Addition of XQ4085XL-1 speed grade part.
Updated timing specifications to match with commercial data sheet. Updated format.
DS029 (v1.3) June 25, 2000
www.xilinx.com
21
Product Specification
1-800-255-7778