X76F100 Datasheet, PDF (15/17 Pages) Xicor Inc. – 1K 128 x 8 Bit

X76F100
PACKAGING INFORMATION
8 Pad Chip on Board Smart Card Module Type X
0.088 (2.24) Min Epoxy
Free Area (Typ.)
0.465 ± 0.002
(11.81 ± 0.05)
0.285 (7.24) Max.
See Note 7 Sht. 2
0.069 (1.75) Min Epoxy
Free Area (Typ.)
R. 0.078 (2.00)
0.420 ± 0.002
(10.67 ± 0.05)
0.270 (6.86) Max.
See Note 7 Sht. 2
A
A
0.008 ± 0.001
(0.20 ± 0.03)
0.210 ± 0.002
(5.33 ± 0.05)
REV 1.0 6/22/00
SECTION A-A
FR4 Tape
0.233 ± 0.002
(5.92 ± 0.05)
Die
Glob Size
0.0235 (0.60) Max.
0.015 (0.38) Max.
0.008 (0.20) Max.
See Detail Sheet 3
Copper, Nickel Plated, Gold Flash
0.174 ± 0.002
0.146 ± 0.002
(4.42 ± 0.05)
(3.71 ± 0.05)
R. 0.013 (0.33) (8x)
0.105 ± 0.002
(2.67 ± 0.05) Typ.
V_CC
RST
(8x)
SCL
0.105 ± 0.002
(2.67 ± 0.05)
(8x)
NC
V_SS
CS
SDA
NC
NOTE: ALL DIMENSIONS IN INCHES AND (MILLIMETERS)
www.xicor.com
Characteristics subject to change without notice. 15 of 16