WM8912 Datasheet, PDF (127/128 Pages) Wolfson Microelectronics plc – Ultra Low Power DAC with Headphone Driver for Portable Audio Applications

Production Data
PACKAGE DIMENSIONS
FL: 32 PIN QFN PLASTIC PACKAGE 4 X 4 X 0.75 mm BODY, 0.40 mm LEAD PITCH
25
24
D2
32
EXPOSED
GROUND 6
PADDLE
L
1
D
4 INDEX AREA
(D/2 X E/2)
A
E2
17
8
16 15
9
b1
e
B
bbb M C A B
BOTTOM VIEW
2X
2X
aaa C
aaa C
A3
C
SEATING PLANE
SIDE VIEW
ccc C
A
0.08 C 5
A1
DETAIL 1
TOP VIEW
A3
b
Exposed lead
G
DETAIL 1
Symbols
A
A1
A3
b
D
D2
E
E2
e
G
L
aaa
bbb
ccc
REF:
Dimensions (mm)
MIN
NOM
MAX
NOTE
0.70
0.75
0.8
0
0.035
0.05
0.203 REF
0.15
0.2
0.25
1
4.00 BSC
2.65
2.7
2.75
2
4.00 BSC
2.65
2.7
2.75
2
0.40 BSC
0.5
0.35
0.40
0.45
Tolerances of Form and Position
0.05
0.10
0.10
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.25 mm FROM TERMINAL TIP.
2. ALL DIMENSIONS ARE IN MILLIMETRES.
3. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
4. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
5. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
WM8912
DM067.A
E
w
PD, Rev 4.0, September 2010
127