W25Q16DVSSIG Datasheet, PDF(9/81 Page) Winbond – 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

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W25Q16DVSSIG Datasheet, PDF (9/81 Pages) Winbond – 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

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3.7 Ball Configuration TFBGA 8x6-mm

W25Q16DV

Figure 1e. W25Q16DV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB or TC)

3.8 Ball Description TFBGA 8x6-mm

BALL NO.

Multiple

PIN NAME

CLK

GND

VCC

/CS

/WP (IO2)

DO (IO1)

DI (IO0)

/HOLD (IO3)

I/O

FUNCTION

Serial Clock Input

Ground

Power Supply

Chip Select Input

I/O

Write Protect Input (Data Input Output 2)*2

I/O

Data Output (Data Input Output 1)*1

I/O

Data Input (Data Input Output 0)*1

I/O

Hold Input (Data Input Output 3)*2

No Connect

*1 IO0 and IO1 are used for Standard and Dual SPI instructions

*2 IO0 â IO3 are used for Quad SPI instructions

Publication Release Date: October 29, 2012

-9-

Revision D

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