W25Q16DVSSIG Datasheet, PDF (4/81 Pages) Winbond – 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q16DV
7.2.38
7.2.39
7.2.40
Program Security Registers (42h) ......................................................................................59
Read Security Registers (48h) ...........................................................................................60
Enable Reset (66h) and Reset (99h)..................................................................................61
8. ELECTRICAL CHARACTERISTICS............................................................................................... 62
8.1 Absolute Maximum Ratings................................................................................................ 62
8.2 Operating Ranges............................................................................................................... 62
8.3 Power-Up Power-Down Timing and Requirements............................................................ 63
8.4 DC Electrical Characteristics .............................................................................................. 64
8.5 AC Measurement Conditions.............................................................................................. 65
8.6 AC Electrical Characteristics .............................................................................................. 66
8.7 AC Electrical Characteristics (cont’d) ................................................................................. 67
8.8 Serial Output Timing........................................................................................................... 68
8.9 Serial Input Timing.............................................................................................................. 68
8.10 HOLD Timing...................................................................................................................... 68
8.11 WP Timing.......................................................................................................................... 68
9. PACKAGE SPECIFICATION .......................................................................................................... 69
9.1 8-Pin SOIC 150-mil (Package Code SN)............................................................................ 69
9.2 8-Pin VSOP 150-mil (Package Code SV)........................................................................... 70
9.3 8-Pin SOIC 208-mil (Package Code SS)............................................................................ 71
9.4 8-Pin VSOP 208-mil (Package Code ST)........................................................................... 72
9.5 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 73
9.6 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 74
9.7 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 76
9.8 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array).......................................... 77
9.9 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 78
10. ORDERING INFORMATION .......................................................................................................... 79
10.1 Valid Part Numbers and Top Side Marking ........................................................................ 80
11. REVISION HISTORY...................................................................................................................... 81
-4-