W25Q16DVSSIG Datasheet, PDF (6/81 Pages) Winbond – 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q16DV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q16DV is offered in an 8-pin SOIC 150-mil or 208-mil (package code SN & SS), an 8-pin VSOP 150-
mil or 208-mil (package code SV & ST), an 8-pad WSON 6x5-mm (package code ZP), an 8-pin PDIP 300-
mil (package code DA), a 16-pin SOIC 300-mil (package code SF) and a 24-ball 8x6-mm TFBGA (5x5 ball
array - package code TB, 6x4 ball array – package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC / VSOP 150 / 208-mil
Top View
/CS
1
8
DO (IO₁)
/WP (IO₂)
GND
2
7
3
6
4
5
VCC
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1a. W25Q16DV Pin Assignments, 8-pin SOIC / VSOP 150 / 208-mil (Package Code SN, SS, SV, ST)
3.2 Pad Configuration WSON 6x5-mm
Top View
/CS
18
VCC
DO (IO₁)
/WP (IO₂)
GND
27
36
45
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1b. W25Q16DV Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP)
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