W25Q16CV_13 Datasheet, PDF (9/81 Pages) Winbond – 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q16CV
3.7 Ball Configuration TFBGA 8x6-mm
Top View
Top View
A2
A3
A4
A5
NC
NC
NC
NC
B1
B2
B3
B4
B5
NC
CLK
GND
VCC
NC
C1
C2
C3
C4
C5
NC
/CS
NC /WP (IO2) NC
D1
D2
D3
D4
D5
NC
DO(IO1) DI(IO0) _/HOLD(IO3) NC
E1
E2
E3
E4
E5
NC
NC
NC
NC
NC
Package Code TB
A1
A2
A3
A4
NC
NC
NC
NC
B1
B2
B3
B4
NC
CLK
GND
VCC
C1
C2
C3
C4
NC
/CS
NC /WP (IO2)
D1
D2
D3
D4
NC DO(IO1) DI(IO0) /HOLD(IO3)
E1
E2
E3
E4
NC
NC
NC
NC
F1
F2
F3
F4
NC
NC
NC
NC
Package Code TC
Figure 1e. W25Q16CV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB or TC)
3.8 Ball Description TFBGA 8x6-mm
BALL NO.
PIN NAME
I/O
FUNCTION
B2
CLK
I
Serial Clock Input
B3
GND
Ground
B4
VCC
Power Supply
C2
/CS
I
Chip Select Input
C4
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)*²
D2
DO (IO1)
I/O
Data Output (Data Input Output 1)*¹
D3
DI (IO0)
I/O
Data Input (Data Input Output 0)*¹
D4
/HOLD (IO3)
I/O
Hold Input (Data Input Output 3)*²
Multiple
NC
No Connect
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
Publication Release Date: October 03, 2013
-9-
Revision G