W25Q16CV_13 Datasheet, PDF (4/81 Pages) Winbond – 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q16CV
7.2.37
7.2.38
7.2.39
Erase Security Registers (44h)...........................................................................................58
Program Security Registers (42h) ......................................................................................59
Read Security Registers (48h) ...........................................................................................60
8. ELECTRICAL CHARACTERISTICS .............................................................................................. 61
8.1 Absolute Maximum Ratings ⁽¹⁾⁽²⁾ ................................................................................... 61
8.2 Operating Ranges .............................................................................................................. 61
8.3 Power-Up Power-Down Timing and Requirements(1)....................................................... 62
8.4 ................................................................................................................................................... 62
8.5 DC Electrical Characteristics.............................................................................................. 63
8.6 AC Measurement Conditions(1) ......................................................................................... 64
8.7 AC Electrical Characteristics .............................................................................................. 65
8.8 AC Electrical Characteristics (cont’d) ................................................................................. 66
8.9 Serial Output Timing........................................................................................................... 67
8.10 Serial Input Timing.............................................................................................................. 67
8.11 HOLD Timing...................................................................................................................... 67
8.12 WP Timing .......................................................................................................................... 67
9. PACKAGE SPECIFICATION .......................................................................................................... 68
9.1 8-Pin SOIC 150-mil (Package Code SN) ........................................................................... 68
9.2 8-Pin VSOP 150-mil (Package Code SV) .......................................................................... 69
9.3 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 70
9.4 8-Pin VSOP 208-mil (Package Code ST) .......................................................................... 71
9.5 8-Pin PDIP 300-mil (Package Code DA)............................................................................ 72
9.6 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 73
9.7 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 75
9.8 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) ......................................... 76
9.9 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................ 77
10. ORDERING INFORMATION .......................................................................................................... 78
10.1 Valid Part Numbers and Top Side Marking ........................................................................ 79
11. REVISION HISTORY...................................................................................................................... 80
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