English
Language : 

W25Q16CV_13 Datasheet, PDF (79/81 Pages) Winbond – 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CV
10.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q16CV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 10-digit number.
Part Numbers for Industrial Grade Temperature:
PACKAGE TYPE
SN(2)
SOIC-8 150mil
SV(2)
VSOP-8 150mil
SS
SOIC-8 208mil
ST(2)
VSOP-8 208mil
SF
SOIC-16 300mil
ZP
WSON-8 6x5mm
DA
PDIP-8 300mil
TB(2)
TFBGA-24 8x6mm
5x5 ball array
TC(2)
TFBGA-24 8x6mm
6x4 ball array
DENSITY
16M-bit
16M-bit
16M-bit
16M-bit
16M-bit
16M-bit
16M-bit
16M-bit
16M-bit
PRODUCT NUMBER
W25Q16CVSNIG
W25Q16CVSNIP
W25Q16CVSVIG
W25Q16CVSVIP
W25Q16CVSSIG
W25Q16CVSSIP
W25Q16CVSSIL
W25Q16CVSSIQ
W25Q16CVSTIG
W25Q16CVSTIP
W25Q16CVSFIG
W25Q16CVSFIP
W25Q16CVSFIQ
W25Q16CVZPIG
W25Q16CVZPIP
W25Q16CVDAIG
W25Q16CVDAIP
W25Q16CVTBIG
W25Q16CVTBIP
W25Q16CVTCIG
W25Q16CVTCIP
TOP SIDE MARKING
25Q16CVNIG
25Q16CVNIP
25Q16CVVIG
25Q16CVVIP
25Q16CVSIG
25Q16CVSIP
25Q16CVSIL
25Q16CVSIQ
25Q16CVTIG
25Q16CVTIP
25Q16CVFIG
25Q16CVFIP
25Q16CVFIQ
25Q16CVIG
25Q16CVIP
25Q16CVAIG
25Q16CVAIP
25Q16CVBIG
25Q16CVBIP
25Q16CVCIG
25Q16CVCIP
Notes:
1. WSON package type ZP is not used in the top side marking.
2. These Package types are Special Order only, please contact Winbond for more information.
- 79 -
Publication Release Date: October 03, 2013
Revision G