W25Q16DW_12 Datasheet, PDF (80/85 Pages) Winbond – 1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

9.4 8-Ball WLBGA (Package Code BY)
W25Q16DW
Note:
Dimension b is measured at the maximum solder bump diameter, parallel to primary datum c.
Symbol
A
A1
c
D
E
D1
D2
D3
E1
E2
E3
b
aaa
bbb
ccc
ddd
eee
Min
0.431
0.152
0.279
1.703
2.658
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---
---
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0.240
Millimeters
Nom
0.472
0.167
0.305
1.758
2.713
0.5000
0.629
0.629
1.5000
0.6065
0.6065
0.300
0.10
0.10
0.03
0.15
0.05
Max
0.512
0.182
0.330
1.783
2.738
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---
---
---
---
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0.360
Min
0.017
0.006
0.011
0.067
0.105
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---
---
---
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0.009
Inches
Nom
0.019
0.007
0.012
0.069
0.107
0.0197
0.0248
0.0248
0.0591
0.0239
0.0239
0.012
0.004
0.004
0.001
0.006
0.002
Max
0.020
0.007
0.013
0.070
0.108
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0.014
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