W25Q16DW_12 Datasheet, PDF (79/85 Pages) Winbond – 1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

8-Pad WSON 6x5-mm (Cont’d.)
W25Q16DW
SYMBOL
M
N
P
Q
R
MILLIMETERS
Min
Nom Max
Min
SOLDER PATTERN
3.40
4.30
6.00
0.50
0.75
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Max
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Is it recommended to connect the metal pad area on the bottom center of the package to the device ground (GND pin). Avoid
placement of exposed PCB vias under the pad.
- 79 -
Publication Release Date: September 06, 2012
Revision F