W24258 Datasheet, PDF (8/11 Pages) Winbond – 32K X 8 CMOS STATIC RAM

W24258
BONDING PAD DIAGRAM
6 5 4 3 2 1 28 28 27 26 25 24 23
S-2 S-1
A4 A5 A6 A7 A1 A1 VDD VDD WE A13 A8 A9 A11
7
24
22
A
3
OE
Y
X
21
8
A10
A2
9
10
11
12
13
14 14 15
S-1 S-2
16
17
18
19
20
A1 A0 I/O1 I/O2 I/O3 VSS VSS I/O4 I/O3 I/O6 I/O7 I/O8 CS
PAD NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14S-1
14S-2
15
16
17
18
19
20
21
22
23
24
25
26
27
28S-1
28S-2
X
-276.73
-421.97
-568.93
-714.17
-861.13
-1006.37
-1190.70
-1190.70
-1023.69
-878.45
-730.05
-584.79
-438.69
-293.69
-152.23
-9.22
437.42
582.68
730.42
875.68
1025.65
1189.20
1188.70
1025.68
878.72
733.48
586.52
441.28
18.40
-131.73
Y
2047.90
2047.90
2047.90
2047.90
2047.90
2047.90
1796.55
-1797.65
-2049.00
-2049.00
-2049.00
-2049.00
-2049.00
-2049.00
-2049.00
-2049.00
-2049.00
-2049.00
-2049.00
-2049.00
-2049.00
-1797.65
1796.55
2047.90
2047.90
2047.90
2047.90
2047.90
2047.90
2047.90
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to VDD or left floating in the PCB layout.
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