W24258 Datasheet, PDF (11/11 Pages) Winbond – 32K X 8 CMOS STATIC RAM

W24258
VERSION HISTORY
VERSION
A4
A5
A6
A7
DATE
Mar. 1997
Jan. 1998
Feb. 1998
Apr. 1998
A8
Nov. 1998
PAGE
DESCRIPTION
8
Add bonding PAD diagram
8
Modify bonding PAD diagram
1, 2, 4, 7 Delete operating temperature (SL = 0 to 70 °C)
3
Add standby power supply current (ISB1) typical
parameter when operation temperature TA = 25° C
1, 3, 7, 10 Deduct reverse type one TSOP package
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Note: All data and specifications are subject to change without notice.
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Publication Release Date: November 1998
Revision A8