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| W25Q80BW_13 Datasheet, PDF (73/74 Pages) Winbond – 1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |||
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W25Q80BW
10.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q80BW SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 10-digit number.
PACKAGE TYPE
SN
SOIC-8 150mil
SV(2)
VSOP-8 150mil
SS
SOIC-8 208mil
ST(2)
VSOP-8 208mil
ZP(1)
WSON-8 6x5mm
BY(3)
WLBGA-8
DENSITY
8M-bit
8M-bit
8M-bit
8M-bit
8M-bit
8M-bit
PRODUCT NUMBER
W25Q80BWSNIG
W25Q80BWSNIP
W25Q80BWSNIL
W25Q80BWSVIG
W25Q80BWSVIP
W25Q80BWSSIG
W25Q80BWSSIP
W25Q80BWSTIG
W25Q80BWSTIP
W25Q80BWZPIG
W25Q80BWZPIP
W25Q80BWBYIG
W25Q80BWBYIC
TOP SIDE MARKING
25Q80BWNIG
25Q80BWNIP
25Q80BWNIL
25Q80BWVIG
25Q80BWVIP
25Q80BWSIG
25Q80BWSIP
25Q80BWTIG
25Q80BWTIP
25Q80BWIG
25Q80BWIP
3Axx
Notes:
1. For WSON packages, the package type ZP is not used in the top side marking.
2. These package types are special order only, please contact Winbond for more information.
3. WLBGA package type BY has special top marking due to size limitation.
3 = 8Mb; A = W25Q series, 1.8V; xx = date code (year, work week).
W25Q80BWBYIC has backside coating.
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Publication Release Date: July 30, 2013
Revision J
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