W25Q80BW_13 Datasheet, PDF (71/74 Pages) Winbond – 1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

9.6 8-Ball WLBGA (Package Code BY)
W25Q80BW
Note: Dimension b is measured at the maximum solder bump diameter, parallel to primary datum c.
Symbol
A
W25Q80BWBYIG
A
W25Q80BWBYIC
A1
c
W25Q80BWBYIG
c
W25Q80BWBYIC
D
E
D1
D2
D3
E1
E2
E3
b
aaa
bbb
ccc
ddd
eee
Min
0.431
0.471
0.152
0.279
0.319
1.356
2.316
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---
---
---
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0.240
Millimeters
Nom
0.472
0.512
0.167
0.305
0.345
1.411
2.371
0.5000
0.4555
0.4555
1.5000
0.4355
0.4355
0.300
0.10
0.10
0.03
0.15
0.05
Max
0.512
0.556
0.182
0.330
0.374
1.436
2.396
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---
---
---
---
---
0.360
Min
0.017
0.019
0.006
0.011
0.013
0.053
0.091
---
---
---
---
---
---
0.009
Inches
Nom
0.019
0.020
0.007
0.012
0.014
0.056
0.093
0.0197
0.0179
0.0179
0.0591
0.0171
0.0171
0.012
0.004
0.004
0.001
0.006
0.002
Max
0.020
0.022
0.007
0.013
0.015
0.057
0.094
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---
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0.014
- 71 -
Publication Release Date: July 30, 2013
Revision J