W25Q80BW_13 Datasheet, PDF (6/74 Pages) Winbond – 1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q80BW
3. PACKAGE TYPES
W25Q80BW is offered in an 8-pin plastic 150-mil or 208-mil width SOIC (package code SN & SS), an 8-
pin VSOP 150-mil or 208-mil (package code SV & ST), 6x5-mm WSON (package code ZP) and an 8-ball
WLBGA (package code BY) as shown in figure 1a-1c respectively. Package diagrams and dimensions
are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC / VSOP 150 / 208-mil
Top View
/CS
1
8
VCC
DO (IO₁)
/WP (IO₂)
GND
2
7
3
6
4
5
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1a. W25Q80BW Pin Assignments, 8-pin SOIC / VSOP 150 / 208-mil (Package Code SN, SS, SV, ST)
3.2 PAD Configuration WSON 6x5-mm
Top View
/CS
18
VCC
DO (IO₁)
/WP (IO₂)
GND
27
36
45
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1b. W25Q80BW Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP)
3.3 Pin Description SOIC / VSOP 150/208-mil, WSON 6x5-mm
PIN NO.
1
2
3
4
5
6
7
8
PIN NAME
/CS
DO (IO1)
/WP (IO2)
GND
DI (IO0)
CLK
/HOLD (IO3)
VCC
I/O
FUNCTION
I
Chip Select Input
I/O
Data Output (Data Input Output 1)*¹
I/O
Write Protect Input ( Data Input Output 2)*²
Ground
I/O
Data Input (Data Input Output 0)*¹
I
Serial Clock Input
I/O
Hold Input (Data Input Output 3)*²
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
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