W25Q40BW_13 Datasheet, PDF (6/73 Pages) Winbond – 1.8V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q40BW
3. PIN CONFIGURATION SOIC/VSOP 150-MIL, SOIC 208-MIL
Top View
/CS
1
8
VCC
DO (IO₁)
/WP (IO₂)
GND
2
7
3
6
4
5
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1a. W25Q40BW Pin Assignments, 8-pin SOIC 150-mil/208-mil, VSOP 150-mil (Package Code SN & SV)
4. PAD CONFIGURATION WSON 6X5-MM, USON 2X3-MM
/CS
DO (IO₁)
/WP (IO₂)
GND
Top View
18
27
36
45
VCC
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1b. W25Q40BW Pad Assignments, 8-pad WSON 6x5-mm, USON 2x3-mm (Package Code ZP & UX)
5. PIN DESCRIPTION SOIC/VSOP 150-MIL, SOIC 208-MIL,WSON 6X5-MM &
USON 2X3-MM
PIN NO.
PIN NAME
I/O
FUNCTION
1
/CS
I
Chip Select Input
2
DO (IO1)
I/O
Data Output (Data Input Output 1)*¹
3
/WP (IO2)
I/O
Write Protect Input ( Data Input Output 2)*²
4
GND
Ground
5
DI (IO0)
I/O
Data Input (Data Input Output 0)*¹
6
CLK
I
Serial Clock Input
7
/HOLD (IO3)
I/O
Hold Input (Data Input Output 3)*²
8
VCC
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
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