W9464G6IB Datasheet, PDF (50/51 Pages) Winbond – 1M × 4 BANKS × 16 BITS DDR SDRAM

12. PACKAGE SPECIFICATION
12.1 60 Ball TFBGA (8x13mm)
W9464G6IB
Package Type: 60 Ball CSP
E
E1
e1
0.20 C
0.20 M S B
// 0.1 C
0.20 M S A ^A
S
0.1 S
Dimension in inch Dimension in mm
Symbol
Min Nom Max Min Nom Max
A
--- --- 0.051 --- --- 1.20
A1 0.01 --- 0.016 0.25 --- 0.40
A
ψb 0.016 --- 0.02 0.40 --- 0.50
D 0.507 0.512 0.515 12.9 13.0 13.1
D1 --- 0.433 --- --- 11.0 ---
E _{0.311 0.315 0.318 7.9 8.0 8.1}
E1 --- 0.252 --- --- 6.40 ---
e1 --- 0.031 --- --- 0.80 ---
e2 --- 0.039 --- --- 1.00 ---
F 0.003 --- --- 0.1 --- ---
“A＂
B
C
0.10 C A1
// 0.2 S
Solder Ball
F
60x ψb
Detail“A＂
ψ0.15 M S A B
ψ0.08 M S
Note: Solder ball is ψ0.45mm before reflow
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Publication Release Date:Oct. 16, 2008
Revision A01