ISD1700 Datasheet, PDF (5/24 Pages) Winbond – Multi-Message Single-Chip Voice Record & Playback Devices

ISD1700 SERIES
y Temperature options:
o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units)
o Industrial: -40°C to +85°C (packaged units)
y Packaging types: available in die, PDIP, SOIC and TSOP
y Package option: Lead-free packaged units
3 BLOCK DIAGRAM
R_OSC
AnaIn
MIC+
MIC-
AGC
Internal
Clock
Timing
Sampling
Clock
AnaIn
Amp
AGC
Amp
Anti-
Aliasing
Filter
Automatic
Gain Control
Nonvolatile
Multi-Level Storage
Array
Smoothing
Filter
Volume
Control
Amp
Amp
Power Conditioning
Device Control
SPI Interface
AUD /
AUX
SP+
SP-
V_CCA V_SSA V_CCP V_SSP1 V_SSP2 V_SSD V_CCD
REC PLAY ERASE FWD FT RESET VOL INT/RDY LED SS SCLK MOSI MISO
Publication Release Date: January 23, 2007
-5-
Revision 1.3-S2