ISD1700 Datasheet, PDF (2/24 Pages) Winbond – Multi-Message Single-Chip Voice Record & Playback Devices

ISD1700 SERIES
TABLE OF CONTENTS
1 GENERAL DESCRIPTION ..............................................................................................................3
2 FEATURES......................................................................................................................................4
3 BLOCK DIAGRAM...........................................................................................................................5
4 PINOUT CONFIGURATION............................................................................................................6
5 PIN DESCRIPTION .........................................................................................................................7
6 MODES OF OPERATIONS .............................................................................................................8
6.1 Standalone (Push-Button) Mode .............................................................................................8
6.2 SPI Mode .................................................................................................................................8
7 TIMING DIAGRAMS ........................................................................................................................8
7.1 Standalone Operation ..............................................................................................................8
7.2 SPI Operation.........................................................................................................................12
8 ABSOLUTE MAXIMUM RATINGS ................................................................................................13
8.1 Operating Conditions .............................................................................................................13
9 ELECTRICAL CHARACTERISTICS .............................................................................................14
9.1 DC Parameters ......................................................................................................................14
9.2 AC Parameters.......................................................................................................................15
10 TYPICAL APPLICATION CIRCUITS.............................................................................................16
10.1 Good Audio Design Practices ................................................................................................18
11 PACKAGING .................................................................................................................................19
11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19
11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC) ..........................................20
11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21
11.4 Die Information.......................................................................................................................21
12 ORDERING INFORMATION .........................................................................................................22
13 VERSION HISTORY......................................................................................................................23
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