ISD1700 Datasheet, PDF (18/24 Pages) Winbond – Multi-Message Single-Chip Voice Record & Playback Devices

ISD1700 SERIES
Example #3: Connecting the SPI Interface to a microcontroller
To uC
SPI
24 _REC
23 _PLAY
25 _ERASE
26 _FWD
19 _VOL
22 _FT
7 _SS
6 _SCLK
5 _MOSI
4 _MISO
ISD1700
Reset
3
RESET
LED ^{2 1 KΩ}
D1
V_CCD 1
V_SSD ²⁸
V_CCD
0.1 μF
vAlert
*
0.1μ F
Vcc
**
V_CCA
**
V_CCD
V_CCP
V_CCA 21
V_SSA 8
V_CCP 14
V_SSP1 16
V_CCP
0.1μF
V_CCA
0.1μ F
*
*
0.1 μ F
*
V_SSP2 12
Gnd
0.1μ F
10
MIC+
11
MIC -
9 _AnaIn
Rosc ***
20
18
*** At 8kHz sampling freq, Rosc = 80 K
4.7 μF
R_OSC
AGC
SP+ ¹⁵
SP- ¹³
Speaker
or Buzzer
V_CC
Speaker
AUD/AUX ¹⁷
V_CCD
INT/RDY ²⁷
100 KΩ
Optional
AUD
AUX ³⁹⁰Ω
8050C
0.1μ F
Optional: based upon the applications
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
10.1
GOOD AUDIO DESIGN PRACTICES
To ensure the highest quality of voice reproduction, it is important to follow good audio design
practices in layout and power supply decoupling. See recommendations from below links or other
Application Notes in our websites.
Design Considerations for ISD1700 Family
AN-CC1002 Design Considerations for ISD1700 Family.pdf
Good Audio Design Practices
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf
Single-Chip Board Layout Diagrams
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf
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