ISD1700 Datasheet, PDF (16/24 Pages) Winbond – Multi-Message Single-Chip Voice Record & Playback Devices

ISD1700 SERIES
10 TYPICAL APPLICATION CIRCUITS
The following typical applications examples on ISD1700 Series are for references only. They make no
representation or warranty that such applications shall be suitable for the use specified. Each design
has to be optimized in its own system for the best performance on voice quality, current consumption,
functionalities and etc.
The below notes apply to the following applications examples:
* These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirements, they can be 10 μF, 4.7 μF or other values.
Please refer to the applications notes or consult Winbond for layout advice.
** It is important to have a separate path for each ground and power back to the related terminals to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible.
Example #1: Recording using microphone input via push-button controls
24 _REC
23 _PLAY
25 _ERASE
26 _FWD
19 _VOL
22 _FT
V_CC
4.7 K Ω
4.7 K Ω
4.7μ F
0.1 μF
0.1 μF
4.7 KΩ
7 _SS
6 _SCLK
5 _MOSI
4 _MISO
10
MIC+
11
MIC -
9 _AnaIn
Rosc ***
20 _ROSC
18 _AGC
4.7 μF
*** At 8kHz sampling freq, Rosc = 80 K
ISD1700
Reset
3
RESET
LED ^{2 1 KΩ}
D1
vAlert
V_CCD
V_CCD 1
V_SSD ²⁸
0.1 μF
*
0.1μ F
Vcc
**
V_CCA
**
V_CCD
V_CCP
V_CCA 21
V_SSA 8
V_CCP 14
V_SSP1 16
V_CCP
0.1μF
V_CCA
0.1μ F
*
*
0.1 μ F
*
V_SSP2 12
Gnd
SP+ ¹⁵
SP- ¹³
Speaker
or Buzzer
V_CC
Speaker
AUD/AUX ¹⁷
V_CCD
INT/RDY ²⁷
100 KΩ
Optional
AUD
AUX ³⁹⁰Ω
8050C
0.1μ F
Optional: based upon the applications
: Digital ground;
: Analog ground;
: Ground for SP+;
: Ground for SP-
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