W25X10_07 Datasheet, PDF (47/48 Pages) Winbond – 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X10, W25X20, W25X40, W25X80
REVISION HISTORY
VERSION
A
B
C
D
E
F
G
H
I
J
K
L
DATE
06/28/05
09/26/05
01/09/06
09/26/05
02/13/06
05/11/06
06/06/06
06/22/06
09/22/06
02/28/07
03/21/07
06/21/07
PAGE
ALL
14, 35
35
ALL
1-3, 5-7, 31,
34, 35-37, &
40-44
1-4, 6, 32-36,
41, 42
32-36
16, 33, 34 &
43
1, 31, 33
32 & 44
13, 22, 36, 38
& 45
DESCRIPTION
New Create
Updated datasheet to comply with Winbond Standard.
Updated hex values in Manufacturer and Device ID
Table. Updated F_R and fr values in Operating Ranges
Table and AC Characteristics Table.
Added availability of 208-mil SOIC package for W25X40.
Added F_R1 and change F_R from 68MHz to 75MHz.
Updated F_R1.
Added W25X10 Specifications.
Added Endurance and Data Retention table (section
10.3).
Added 8 pin PDIP (300 mil).
Updated the output load cap.15 pF for F_R1 (75 MHz).
Updated temp. range for F_R1 and added F_R0.
Added 6x5 mm WSON package.
Updated Endurance and Data Retention table (11.3),
ICC’s in DC Parameter table (11.5 & 11.6).
Reduced t_PP (max) from 5mS to 3mS.
Added byte programming parameters (t_BP1 & t_BPn).
Changed tSHCH from 5nS to 0nS.
Added additional byte programming t_BP2 and moved
multiple byte programming t_BPn with formula to foot note.
Corrected Write Enable/Disable text.
Change ICC2 from 5uA to 10uA.
Added footnotes in the ordering information table.
Removed preliminary designation.
Updated ICC3 specs.
Updated table 11.3.
Added valid product number and top side marking table.
Updated Memory Protection table.
Updated Page Program description & footnote for tBP1.
Added 40MHz AC characteristics table.
Updated Ordering Information table.
- 47 -
Publication Release Date: June 21, 2007
Revision L