W25X10_07 Datasheet, PDF (40/48 Pages) Winbond – 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X10, W25X20, W25X40, W25X80
12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 150-mil (Package Code SN)
SYMBOL
A
A1
A2
b
C
D⁽³⁾
E
E1⁽³⁾
e⁽²⁾
L
θ
CP
MILLIMETERS
MIN
TYP.
MAX
1.47
1.60
1.72
0.10
---
0.24
---
1.45
---
0.33
0.41
0.50
0.19
0.20
0.25
4.80
4.85
4.95
5.80
6.00
6.19
3.80
3.90
4.00
1.27 BSC
0.40
0.71
1.27
0^o
---
8^o
---
---
0.10
INCHES
MIN
0.058
0.004
---
0.013
0.0075
0.189
0.228
0.150
0.015
0^o
---
TYP.
0.063
---
0.057
0.016
0.008
0.191
0.236
0.154
0.050 BSC
0.028
---
---
MAX
0.068
0.009
---
0.020
0.0098
0.195
0.244
0.157
0.050
8^o
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
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